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      View The Printed Circuit Designer's Guide to: Thermal Management with Insulated Metal Substrates, Vol. 2 by D. Mauve and R. Art, VentecPreview
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      The Printed Circuit Designer's Guide to: Thermal Management with Insulated Metal Substrates, Vol. 2

      by D. Mauve and R. Art, Ventec

      This is the price your customers see. Edit price list

      Softcover
      Flexible, high-gloss laminated cover
      Quantity:
      VAT will be added at checkout.
      About the Book

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      This book covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.

      Readers will learn the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary. One of the most pertinent questions answered is how to improve reliability of components as they become increasingly smaller.
      Features & Details

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      • Primary Category: Education
      • Project Option: 6×9 in, 15×23 cm
        # of Pages: 60
      • Isbn
        • Softcover: 9798985602050
      • Publish Date: Jul 25, 2022
      • Language English
      • Keywords PCBs, new product introduction, NPI
      See More
      About the Creator
      I-007eBooks
      BR Publishing, Inc.
      Salem, Oregon

      With over 30 years in the industry, BR Publishing, Inc. is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

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